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Ultra-low profile copper foil
Ultra Low Profile Copper Foil, also known as Extremely Low Profile or Compute Copper Foil, is designed for AI compute chips, high-speed PCBs, and advanced packaging. With an ultra-low surface roughness (Rz ≤ 1.0μm), it significantly reduces high-frequency signal transmission loss and enhances signal integrity. Ideal for high-end applications including high-speed/high-frequency PCBs, AI servers, 5G base stations, and advanced packaging substrates.
Material
High-purity electrolytic copper
Application Areas
AI servers, high-speed PCBs, 5G base stations, advanced packaging substrates, and high-frequency communication equipment
Key Features
- Ultra-low surface roughness Rz ≤ 1.0μm
- Reduce high-frequency signal transmission loss by 30%+
- Excellent Peel Strength
- Optimized for high-speed PCB manufacturing processes
- Supports AI computing chip packaging requirements